The National Institute of Standards and Technology (NIST) is seeking public comment on a draft plan for federal government engagement in advancing artificial intelligence (AI) standards for U.S. economic and national security needs. The draft plan recommends four actions: bolster AI standards-related knowledge, leadership and coordination among federal agencies; promote focused research on the “trustworthiness” of AI; support and expand public-private partnerships; and engage with international parties.
The document U.S. Leadership in AI: Plan for Federal Engagement in Developing Technical Standards and Related Tools, was published on July 2, 2019 in response to a February 2019 Executive Order that directed federal agencies to take steps to ensure that the U.S. maintains its leadership position in AI. The draft plan was developed with input from various stakeholders through a May 1 Request for Information, a May 30 workshop and federal agency review. Comments may be submitted to email@example.com through July 19, 2019. In accordance with the February Executive Order, a final plan is due to the White House on August 10, 2019.
The White House has released an update to the National AI R&D Strategic Plan [pdf]. The new document defines the priority areas for Federal investments in AI R&D. It builds upon the first National AI R&D Strategic Plan released in 2016, accounting for new research, technical innovations, and other considerations that have emerged over the past three years. The update has been developed by leading AI researchers and research administrators from across the Federal Government, with input from the broader civil society, including from many of America’s leading academic research institutions, nonprofit organizations, and private sector technology companies. Stakeholder feedback validated the provisions of the 2016 Strategic Plan while also calling for greater attention to making AI trustworthy, to partnering with the private sector, and other imperatives.
To gain a better understanding of the emerging opportunities, challenges, and implications resulting from developments in AI, the Comptroller General of the United States convened a Forum on Artificial Intelligence, which was held on July 6 and 7, 2017, in Washington, D.C.
Participants from industry, government, academia, and nonprofit organizations considered the potential implications of AI developments in four sectors–cybersecurity, automated vehicles, criminal justice, and financial services. Participants considered policy implications of broadening AI use in the economy and society, as well as associated opportunities, challenges, and areas in need of more research. Following the forum, participants were given the opportunity to review a summary of forum discussions and a draft of this report. Additionally, a draft of the report was reviewed independently by two experts who did not attend the forum.
Building security into modern semiconductor chips is more than a technical challenge — it is a complex mix of economic and technology tradeoffs. Incorporating security into chips is a manual, expensive, and cumbersome task that requires significant time and a level of expertise that is not readily available in most chip and system companies. The inclusion of security also often requires certain trade-offs with the typical design objectives, such as size, performance, and power dissipation.
A new research effort by the Defense Advanced Research Agency (DARPA) — the Automatic Implementation of Secure Silicon (AISS) program — seeks to automate the process of incorporating scalable defense mechanisms into chip designs, while allowing designers to explore economics versus security trade-offs and maximize design productivity.
AISS is part of the second phase of DARPA’s Electronics Resurgence Initiative (ERI) – a five-year, upwards of $1.5 billion investment in the future of domestic, U.S. government, and defense electronics systems. Under ERI Phase II, DARPA is exploring the development of trusted electronics components, including the advancement of electronics that can enforce security and privacy protections. AISS will help address this mission through its efforts to enable scalable on-chip security.
A Broad Area Announcement (BAA) is forthcoming. DARPA will hold a Proposers Day on April 10, 2019 at the DARPA Conference Center, located at 675 North Randolph Street, Arlington, Virginia 22203, to provide more information about AISS and answer questions from potential proposers.
The Government-University-Industry Research Roundtable of the National Academy of Sciences and Engineering will host a webinar to discuss the Quantum Economic Development Consortium (QED-C), which was established in 2018 by the National Quantum Initiative Act.
With support from the National Institute for Standards and Technology (NIST) and more than 50 companies with a stake in quantum technologies, the QED-C mission is to strengthen U.S. leadership in the quantum technology industry. QED-C is focused on identifying and addressing enabling technology gaps, prioritizing needs for standards and performance metrics; and understanding workforce requirements. A purpose of the consortium is to inform government and academic members of the quantum community of industry priorities and needs. QED-C will also facilitate connections to enhance quantum-related research, innovation, education, and technology transfer.
To register for the webinar please see the GUIRR QED-C webpage
The White House has launched a new site — Artificial Intelligence for the American People — to serve as a clearinghouse for the growing U.S. initiative in A.I. and A.I. research. The site includes links to the key policy documents that undergrid the initiative including the recent Executive Order signed by the President in February.
The NITRD Health Information Technology Research and Development Interagency Working Group (HITRD IWG) requests input to collect information on new approaches from industry, academia, and non-governmental organizations, to solve the interoperability issues between medical devices, data, and platforms.
Interested persons are invited to submit comments to the Federal Register on or before 11:59 p.m. (ET) on March 15, 2019.
The Government anticipates hosting a conference in June/July 2019 to allow for additional engagement. The results of the conference discussion, in addition to the written responses to this RFI, will be used to determine next steps in addressing federal efforts in interoperability of data, platforms, and medical devices. This RFI is solely issued to engage with interested parties to inform the Government on developing a strategy for medical device, data, and platform interoperability. The Government will not reimburse costs associated with participating in the conference. The Government may contact respondents regarding their submissions, such as to ask questions, to learn more, or to notify them of further developments related to the effort.