The Department of Commerce has released new application materials and other resources for the first CHIPS for America funding opportunity for various types of semiconductor fabrication facilities. Commerce has also posted full application materials for applicants seeking incentives for leading-edge facilities.
The Department is asking applicants to submit detailed applications so that it has all the information it needs to evaluate applications and plan awards across the semiconductor ecosystem. This will include financial models that will help reviewers evaluate the commercial viability and financial strength of projects and ensure the application is emphasizing important program priorities such as activating third party capital and customer commitments.
